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BGA Solder Ball Mounter SBP662
BGA Solder Ball Mounter SBP662
Ball implanters are widely used in the semiconductor industry for wafer packaging, testing, and assembly to improve production efficiency and product quality. In the field of electronic equipment manufacturing, they are used to produce various electronic components, such as integrated circuits and sensors. In the aerospace field, they are used to produce high-reliability electronic equipment, such as satellites and rockets.

BGA Solder Ball Mounter SBP662

 详情说明
Product Introduction


Equipment advantages: The ball implanter uses automation technology, which can greatly improve production efficiency and reduce labor costs. Through precise control, the quality of the product can be guaranteed and the production of defective products can be reduced. The use of advanced production processes can reduce production costs and improve the competitiveness of enterprises.


Main function: It is to fix tiny electronic components on the circuit board to ensure the stable operation of electronic equipment. In addition, the ball implanter can also improve the reliability and performance of electronic equipment.


Equipment application: The ball implanter is widely used in the semiconductor industry in wafer packaging, testing and assembly to improve production efficiency and product quality. In the field of electronic equipment manufacturing, it is used to produce various electronic components, such as integrated circuits, sensors, etc. In the field of aerospace, it is used to produce high-reliability electronic equipment, such as satellites, rockets, etc.


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